this is information on a product in full production. november 2014 docid024471 rev 2 1/8 8 HSP061-2Y automotive 2-line esd protection for high speed lines datasheet - production data figure 1. functional diagram (top view) features ? flow-through routing to keep signal integrity ? ultralarge bandwidth: 6 ghz ? ultralow capacitance: 0.6 pf ? low leakage current: 100 na at 25 c ? extended operating junction temperature range: -40 c to 150 c ? rohs compliant ? aec-q101 qualified benefits ? high esd robustness of the equipment ? suitable for high density boards complies with following standards: ? iso 10605 - c = 150 pf, r = 330 ? 30 kv (air discharge) ? 15 kv (contact discharge) ? iso 10605 - c = 330 pf, r = 330 ? 30 kv (air discharge) ? 15 kv (contact discharge) ? iso 7637-3: ? pulse 3a: vs = -150 v ? pulse 3b: vs = +100 v applications the HSP061-2Y is designed to protect against electrostatic discharge on automotive circuits driving: ? apix ? lvds ? hdmi 1.3 and 1.4 ? ethernet ? digital video interface ? display port ? usb 3.0 ? serial ata ? high speed communication buses ? hmi description the HSP061-2Y is a 2-channel esd array with a rail to rail architecture designed specifically for the protection of high speed differential lines. the ultralow variation of the capacitance ensures very low influence on signal-skew. the large bandwidth makes it compatible with 5 gbps. hsp061-2p6y sot666 1 16 2 5 3 4 i/o1 i/o1 gnd v bus i/o2 i/o2 hsp061-2p6y sot666 www.st.com
characteristics HSP061-2Y 2/8 docid024471 rev 2 1 characteristics table 1. absolute maximum ratings t amb = 25 c symbol parameter value unit v pp (1) peak pulse voltage iso 10605 - c = 150 pf, r = 330 contact discharge air discharge iso 10605 - c = 330 pf, r = 330 contact discharge air discharge 15 30 15 30 kv i pp peak pulse current (8/20 s) 3 a t j operating junction temperature range -40 to +150 c t stg storage temperature range -65 to +150 c t l maximum lead solder temperature (10 s duration) 260 c 1. for a surge greater than the maximum values, the diode will fail in short-circuit. table 2. electrical characteristics t amb = 25 c symbol parameter test conditions min. typ. max. unit v br breakdown voltage i r = 1 ma 6 v i r leakage current v r = 5 v 150 na v r = 3 v 100 v cl clamping voltage iso 10605 - c = 150 pf, r = 330 +8 kv contact discharge, measured at 30 ns 18 v c i/o - gnd capacitance (input/output to ground) v i/o = 0 v, f = 200 to 3000 mhz, v osc = 30 mv 0.6 0.85 pf c i/o - gnd capacitance variation (input/output to ground) v i/o = 0 v f = 200 to 3000 mhz, v osc = 30 mv 0.03 0.08 pf f c cut-off frequency -3 db 5.5 ghz
docid024471 rev 2 3/8 HSP061-2Y characteristics figure 4. eye diagram - hdmi mask at 3.4 gbps per channel figure 2. leakage current versus junction temperature (typical values) figure 3. s21 attenuation measurement tj (c) 0.01 0.10 1.00 10.00 25 50 75 100 125 150 i r (na) v r =v rm = 3 v s21(db) 300.0k 1.0m 3.0m 10.0m 30.0m 100.0m 300.0m 1.0g 3.0g -16.00 -12.00 -8.00 -4.00 0.00 f(hz) 250 mv/div 49 ps/div figure 5. esd response to iec 61000-4-2 (+8 kv contact discharge) figure 6. esd response to iec 61000-4-2 (-8 kv contact discharge) 20 ns/div 50 v/div 20 ns/div 50 v/div
application information HSP061-2Y 4/8 docid024471 rev 2 2 application information more information is available in the stmicroelectronics application note: an2689, ?protection of automotive electronics from electrical hazards, guidelines for design and component selection?. figure 7. response to iso 7637-3 pulse 3a (us = -150 v) figure 8. response to iso 7637-3 pulse 3b (us = +100 v) 5 v/div 500 ma/div 50 ns/div 50 ns/div 500 ma/div 5 v/div
docid024471 rev 2 5/8 HSP061-2Y package information 3 package information ? epoxy meets ul94, v0 ? lead-free packages in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 9. sot666 dimension definitions d b l3 l1 e b1 e1 l2 e a a3
package information HSP061-2Y 6/8 docid024471 rev 2 note: product marking may be rotated by 90 or 180 to differentiate assembly location. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. table 3. sot666 dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.45 0.60 0.018 0.024 a3 0.08 0.18 0.003 0.007 b 0.17 0.34 0.007 0.013 b1 0.19 0.27 0.34 0.007 0.011 0.013 d 1.50 1.70 0.059 0.067 e 1.50 1.70 0.059 0.067 e1 1.10 1.30 0.043 0.051 e 0.50 0.020 l1 0.19 0.007 l2 0.10 0.30 0.004 0.012 l3 0.10 0.004 figure 10. footprint recommendations dimensions in mm (inches) figure 11. marking 0.50 (0.019) 2.60 (0.01) 0.62 (0.024) 0.30 (0.012) 0.99 (0.039) ry
docid024471 rev 2 7/8 HSP061-2Y ordering information 4 ordering information figure 12. ordering information scheme 5 revision history table 4. ordering information order code marking package weight base qty delivery mode hsp061-2p6y ry (1) 1. the marking can be rotated by 90 or 180 to differentiate assembly location sot-666 3 mg 3000 tape and reel hsp 06 1 - 2 p6 y high speed line protection breakdown voltage version number of lines package p6 = sot-666 automotive grade table 5. document revision history date revision changes 17-oct-2013 1 initial release. 19-nov-2014 2 updated figure 5 , figure 6 and table 4 . added figure 7 and figure 8 .
HSP061-2Y 8/8 docid024471 rev 2 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2014 stmicroelectronics ? all rights reserved
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